Polish formulations

Details Polish formulations Polish formulations

C - Chemistry, Metallurgy

09

G

400/1701, 400/40

C09G 1/00 (2006.01) C09G 1/16 (2006.01)

Patent

CA 1123542

Abstract of the Disclosure Improvement of polish formulations containing a wax and/or an abrasive and optionally at least one member selected from the group consisting of solvents, surfactants, thickening agents, detergent resistant additives, colorants, odorants, and other ingredients normally used in making polishes is disclosed by incorporating in the polish (a) a cyclodimethylsiloxane fluid, (b) a polydiorganosiloxane- polyoxyalkylene copolymer, and (c) water. Further advantages may also be achieved by the incorporation of an organic water-in-oil surfactant having an HLB value of 2-10 and/or certain silicone-glycol copolymers in the polish.

332650

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