Polishing apparatus

Details Polishing apparatus Polishing apparatus

B - Operations, Transporting

24

B

51/1

B24B 31/00 (2006.01) B24B 31/02 (2006.01)

Patent

CA 2003185

ABSTRACT OF THE DISCLOSURE A polishing apparatus comprising a sub-rotating shaft provided radially displaced from a main rotation center being mounted to rotators, preferably rotators such as balance weight, rotating round said main rotating center, and a circular or polygonal type cylindrical polishing bath rotating round said sub-rotating shaft and wherein polish- ing materials and workpieces to be polished are charged. An effective polishing can be achieved by having said sub- rotating shaft rotated round the main rotation center at the fixed velocity ratio and in a fixed direction in relation to the main rotation center, thereby making it possible to get a maximal capacity of the polishing bath. - 1 -

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