C - Chemistry – Metallurgy – 25 – F
Patent
C - Chemistry, Metallurgy
25
F
15/6
C25F 7/00 (2006.01) B24B 7/22 (2006.01) B24B 19/00 (2006.01) B24B 27/00 (2006.01)
Patent
CA 1071812
ABSTRACT OF THE DISCLOSURE An apparatus for automatically polishing the cathode mother plate (hereinafter called mother plate) stripped of the electrolytically deposited metal in an electrolytic metal recovery system. The apparatus comprises a lift means to lift the mother plate from the conveyor carrying vertically dis- posed mother plates having been stripped of the deposited metal in the previous step, and two polishing means disposed adjacent to the lift means for polishing both surfaces of the mother plates, whereby the mother plates are polished in a short period comparable to that required for stripping opera- tions, permitting the polishing apparatus to be built in the stripping system.
273937
Hashimoto Shigetoshi
Nishiyama Keisuke
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