Polishing material

Details Polishing material Polishing material

C - Chemistry, Metallurgy

09

G

C09G 1/02 (2006.01)

Patent

CA 2110615

A novel polishing slurry for particularly hard materials such as silicon carbide has been found. The slurry comprises diamond particles with a median particle size of around a micron and alpha alumina particles with a median size of from about 20 to about 200 nanometers.

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