Polishing of sapphire with composite slurries

Details Polishing of sapphire with composite slurries Polishing of sapphire with composite slurries

C - Chemistry, Metallurgy

09

K

C09K 3/14 (2006.01)

Patent

CA 2700413

Improved slurry compositions comprising a mixture of a first type of particles and a second type of abrasive particles dispersed within an aqueous medium, and abrasive slurry compositions for use chemical mechanical planarization (CMP) processes, particularly abrasive slurry compositions for polishing of sapphire. These abrasive slurry compositions comprise a mixture of a first type of abrasive particles having a hardness that is harder than the surface being polished and a second type of abrasive particles have a hardness that is softer than the surface being polished, particularly mixtures of silicon carbide abrasive particles and silica abrasive particles, dispersed within an aqueous medium.

L'invention concerne des compositions de suspension épaisse améliorées comprenant un mélange d'un premier type de particules et d'un second type de particules abrasives dispersées dans un milieu aqueux, et des compositions de suspension épaisse abrasives pour une utilisation dans des processus d'aplanissement chimique et mécanique (CMP), notamment des compositions de suspension épaisse abrasives pour polir le saphir. Ces compositions de suspension épaisse abrasives comprennent un mélange d'un premier type de particules abrasives ayant une dureté supérieure à la surface soumise au polissage et un second type de particules abrasives ayant une dureté inférieure à la surface soumise au polissage, notamment des mélanges de particules abrasives de carbure de silicium et de particules abrasives de silice, dispersées dans un milieu aqueux.

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