Polishing pad

Details Polishing pad Polishing pad

B - Operations, Transporting

24

D

B24D 3/20 (2006.01) B24B 7/22 (2006.01) B24D 3/30 (2006.01) B24D 7/06 (2006.01)

Patent

CA 2091660

ABSTRACT A polishing pad comprises a carrier and layer of a non-porous thermoplastic polymer secured to a surface thereof and containing a mass of discrete abrasive particles uniformly dispersed therein. The abrasive particles have a particle size of up to 500 microns and are present in the layer in a concentration of up to 30 volume percent. The layer presents an abrasive polishing surface. The abrasive layer may also comprise a plurality of spaced strips secured to a surface of the carrier and each strip presents an abrasive polishing surface.

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