Polishing slurries and methods for utilizing same

Details Polishing slurries and methods for utilizing same Polishing slurries and methods for utilizing same

C - Chemistry, Metallurgy

09

G

C09G 1/02 (2006.01) H01L 21/321 (2006.01)

Patent

CA 2624246

A polishing slurry includes liquid medium and particulate abrasive. The particulate abrasive includes soft abrasive particles, hard abrasive particles, and colloidal silica particles, wherein the soft abrasive particles have a Mohs hardness of not greater than 8 and the hard abrasive particles have a Mohs hardness of not less than 8, and wherein the soft abrasive particles and the hard abrasive particles are present at a weight ratio of not less than 2: 1.

L'invention concerne une pâte de polissage qui contient un milieu liquide et un abrasif en particules. L'abrasif en particules comprend des particules d'abrasif doux, des particules d'abrasif dur, et des particules de silice colloïdale, les particules d'abrasif doux présentant une dureté Mohs ne dépassant pas 8, les particules d'abrasif dur présentant une dureté Mohs d'au moins 8, et le rapport pondéral entre les particules d'abrasif doux et les particules d'abrasif dur étant d'au moins 2: 1.

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