C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/18, 117/64
C25D 5/34 (2006.01) C08J 7/14 (2006.01) C23C 18/24 (2006.01) C23C 18/54 (2006.01) H05K 1/03 (2006.01) H05K 3/38 (2006.01) H05K 3/18 (2006.01)
Patent
CA 1232864
Abstract of the Disclosure A printed circuit board is made of a poly(arylene sulfide) board and a conductive metal deposited on the board by electroless plating, optionally followed by electroplating. Adhesion between the poly(arylene sulfide) and the conductive metal is improved by allowing the plated poly(arylene sulfide) to age.
427672
Benefield Robert E. Jr.
Boeke Paul J.
Boultinghouse Harold D.
Leland John E.
Osler Hoskin & Harcourt Llp
Phillips Petroleum Company
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