Poly(arylene sulfide) printed circuit boards

C - Chemistry – Metallurgy – 25 – D

Patent

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Details

204/18, 117/64

C25D 5/34 (2006.01) C08J 7/14 (2006.01) C23C 18/24 (2006.01) C23C 18/54 (2006.01) H05K 1/03 (2006.01) H05K 3/38 (2006.01) H05K 3/18 (2006.01)

Patent

CA 1232864

Abstract of the Disclosure A printed circuit board is made of a poly(arylene sulfide) board and a conductive metal deposited on the board by electroless plating, optionally followed by electroplating. Adhesion between the poly(arylene sulfide) and the conductive metal is improved by allowing the plated poly(arylene sulfide) to age.

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