C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/7601, 400/76
C08L 67/02 (2006.01) C08K 5/03 (2006.01) C08K 5/25 (2006.01) H01B 3/42 (2006.01)
Patent
CA 1235838
ABSTRACT There is provided an improved molding resin capable of being molded into an article exhibiting reduced tendency to corrode a copper surface when the molded resin and the copper surface are placed in spaced relationship in a common unventilated atmosphere at elevated temperatures, as measured by the Bell Telephone Laboratories Copper Corrosion Test at tempera- tures within the range of from 150° to 175°C, wherein the molding resin comprises the combination of (a) a poly(butylene terephthalate) based polymer and aromatic halogen groups in a flame retardant amount, and (b) an alkylhydroxyphenylalkanoyl-hydrazine in an amount that is within the range of from 0.05 to 0.6% by weight, based on the weight of the molding resin, and less than 0.8% by weight based on the polymer.
453002
Shearer Wilfred L.
Sinker Stephen M.
Wolf Richard A.
Celanese Corporation
Smart & Biggar
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