C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
402/403, 402/418
C08F 210/00 (2006.01) C08F 210/06 (2006.01) C08F 210/14 (2006.01) C09J 123/16 (2006.01) C09J 123/18 (2006.01) C09J 123/20 (2006.01)
Patent
CA 1062400
\ ABSTRACT OF THE DISCLOSURE This invention relates to single component, hot-melt, pressure-sensitive adhesives based on propylene and/or 1-butene/ higher 1-olefin copolymers containing 40-60 mole % of the higher 1-olefin. Suitable comonomers include 1-hexene through 1-decene. These new adhesives can be readily applied to substrates such as tape by means of conventional hot-melt coating equipment and thereby eliminate the solvent pollution problems associated with the application of current solvent-based pressure-sensitive adhesives. Our hot-melt coated tapes generally have pressure- sensitive adhesive properties at least equivalent to those of solvent coated pressure-sensitive tapes.
247772
Joyner Frederick B.
Mcconnell Richard L.
Weemes Doyle A.
Eastman Kodak Company
Na
LandOfFree
Poly(higher-1-olefin-co-propylene) copolymers as hot-melt,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Poly(higher-1-olefin-co-propylene) copolymers as hot-melt,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Poly(higher-1-olefin-co-propylene) copolymers as hot-melt,... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-643853