Poly-oxymethylene molding compounds

Details Poly-oxymethylene molding compounds Poly-oxymethylene molding compounds

C - Chemistry, Metallurgy

08

L

400/1, 400/5449

C08L 59/02 (2006.01) C08L 61/28 (2006.01)

Patent

CA 1078537

ABSTRACT OF THE DISCLOSURE The present invention provides a molding compound based on a poly-oxymethylene and containing a melamine-formaldehyde polycondensate and an antioxidant, said compound containing 0.001 to 30% by weight, relative to the total weight of the molding compound, of a finely divided, cross-linked, water-insoluble precipitation polycondensate produced from formaldehyde and mela- mine in a molar ratio between 1.2:1 and 10.0:1.

260935

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