Poly(vinyl chloride)/polyamide multi-layer structures

Details Poly(vinyl chloride)/polyamide multi-layer structures Poly(vinyl chloride)/polyamide multi-layer structures

B - Operations, Transporting

32

B

18/774, 18/783

B32B 27/08 (2006.01) B32B 27/34 (2006.01) H01B 3/30 (2006.01) H01B 3/44 (2006.01) H01B 7/282 (2006.01)

Patent

CA 1319239

Abstract of the Disclosure POLY(VINYL CHLORIDE)/POLYAMIDE LAMINATES The present invention provides a multi-layer structure having improved adhesion between its layers. The multi-layer structure has in the following order: a layer of PVC, a layer of adhesive resin. and a layer of polyamide. The adhesive resin comprises organic solvent, vinyl resin. phthalate plasticizer. and leveling agent. The vinyl resin is selected from the group consisting of vinyl chloride-vinyl acetate-vinyl alcohol terpolymer (VAGH), vinyl chloride-vinyl acetate copolymer (VYHH), and vinyl chloride-vinyl acetate-maleic acid terpolymer (VMCM). Electrical conductors formed from a wire conductor and the multi-layer structure nave superior adhesion between layers even after the polyamide layer absorbs moisture.

591636

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