C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 59/00 (2006.01) C08G 18/56 (2006.01) C08K 5/29 (2006.01) C08K 5/372 (2006.01) C09J 175/00 (2006.01)
Patent
CA 2070402
ABSTRACT A polyacetal resin composition which comprises a polyacetal resin (as component A) and one or more members selected from the group consisting of an isocyanate com- pound, isothiocyanate compound, and modified product thereof (as component B) in an amount of 0.1-15 wt% of the composition, said polyacetal resin composition exhibiting good adhesion properties when bonded with a curable reac- tive resin adhesive. The present invention also relates to a part comprising a combination of the mold consisting of the composition and the adhesive. - 16 -
Fukasawa Jun
Wakatsuka Sei
Polyplastics Co. Ltd.
Smart & Biggar
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