Polyacetal resin composition

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 59/00 (2006.01) C08G 18/56 (2006.01) C08K 5/29 (2006.01) C08K 5/372 (2006.01) C09J 175/00 (2006.01)

Patent

CA 2070402

ABSTRACT A polyacetal resin composition which comprises a polyacetal resin (as component A) and one or more members selected from the group consisting of an isocyanate com- pound, isothiocyanate compound, and modified product thereof (as component B) in an amount of 0.1-15 wt% of the composition, said polyacetal resin composition exhibiting good adhesion properties when bonded with a curable reac- tive resin adhesive. The present invention also relates to a part comprising a combination of the mold consisting of the composition and the adhesive. - 16 -

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