C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 59/00 (2006.01) C08K 3/00 (2006.01) C08L 25/08 (2006.01) C08L 33/00 (2006.01) C08L 25/04 (2006.01) C08L 101/00 (2006.01)
Patent
CA 2058348
Abstract The object of the present invention is to provide a polyacetal resin composition structure having a good surface appearance, a low molding shrinkage and excellent properties through the formation of an interpenetrating network dispersion structure in a composition comprising a polyacetal resin and a polystyrene resin incorporated therein. The constitution of the present invention is that a polyacetal resin (A), a polystyrene resin (B) and a filler (C) having a larger surface tension at the melt kneading temperature than that of at least the component B and a mean particle diameter of 0.05 to 50 µm are melt-kneaded with each other in a weight ratio satisfying the relationship represented by the following formulae (1) and (2): B/(A + B) = 0.05 to 0.5 (by weight) (1) C/(B + C) = 0.1 to 0.7 (by weight) (2).
Miyawaki Keiichi
Sano Hiroyuki
Tajima Yoshihisa
Polyplastics Co. Ltd.
Smart & Biggar
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