Polyacrylic hot melt adhesives

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/6430

C08L 33/06 (2006.01) C08F 265/06 (2006.01) C08L 33/14 (2006.01) C09J 133/06 (2006.01) C09J 133/14 (2006.01) C08L 33/08 (2006.01)

Patent

CA 1068038

ABSTRACT OF THE DISCLOSURE Novel polyacrylic hot melt adhesives prepared by blending a polymer having a Tg of -85° to 0°C. with a polymer having a Tg of 20° to 150°C. are disclosed.

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