Polyamic acid structures, and methods of fabrication thereof

Details Polyamic acid structures, and methods of fabrication thereof Polyamic acid structures, and methods of fabrication thereof

B - Operations, Transporting

29

C

B29C 39/14 (2006.01) B29C 39/38 (2006.01) B32B 27/06 (2006.01) B32B 27/34 (2006.01) C08G 73/10 (2006.01) C08J 5/18 (2006.01) C09D 179/08 (2006.01) H01B 3/30 (2006.01) H05K 1/03 (2006.01) H05K 1/05 (2006.01)

Patent

CA 2044573

ABSTRACT OF THE DISCLOSURE A structure comprising a free-standing polyamic acid film substantially free of phthalic acids. A method of fabricating such a structure which comprises applying a polyamic acid solution to a substrate, partially or substantially completely removing the solvent from the polyamic acid solution by heating the same, removing the free-standing polyamic acid film which is free from phthalic acids, laminating the film to a substrate at elevated temperature and pressure and thermally curing the laminated, free-standing polyamic acid film to the corresponding polyimide. A structure comprising one or a plurality of such free-standing polyamic acid films with electrically conducting layers therebetween is also disclosed as is a method of fabricating such a structure. Further disclosed is the use of a thermoplastic polyimide adhesive precursor which permits 2nd level multilayer packaging applications and a method for forming such packaging.

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