Polyamide adhesive for bonding fabrics

C - Chemistry – Metallurgy – 08 – G

Patent

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154/101, 402/230

C08G 69/36 (2006.01) B32B 27/04 (2006.01) C09J 177/08 (2006.01)

Patent

CA 1104749

ABSTRACT OF THE DISCLOSURE There is disclosed a polyamide adhesive for bonding fabrics, particularly fusible interliners for fabrics, which are cleanable by laundering and/or dry cleaning. The polyamide adhesive is a terpolyamide of caprolactam and hexamethylene diamine with a mixture of polymeric fat acids and an aliphatic co-dicarboxylic acid having 10-12 carbon atoms.

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