C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
154/101, 402/230
C08G 69/36 (2006.01) B32B 27/04 (2006.01) C09J 177/08 (2006.01)
Patent
CA 1104749
ABSTRACT OF THE DISCLOSURE There is disclosed a polyamide adhesive for bonding fabrics, particularly fusible interliners for fabrics, which are cleanable by laundering and/or dry cleaning. The polyamide adhesive is a terpolyamide of caprolactam and hexamethylene diamine with a mixture of polymeric fat acids and an aliphatic co-dicarboxylic acid having 10-12 carbon atoms.
316846
Kanten H. Gordon
Peerman Dwight E.
Fetherstonhaugh & Co.
Henkel Corporation
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