Polyamide adhesives having improved bookbinding characteristics

Details Polyamide adhesives having improved bookbinding characteristics Polyamide adhesives having improved bookbinding characteristics

C - Chemistry, Metallurgy

09

J

C09J 177/08 (2006.01) B42C 9/00 (2006.01) C09J 177/12 (2006.01) C09J 193/04 (2006.01)

Patent

CA 2200015

A method of bookbinding comprising the steps of a) applying a film comprising at least one hot melt polyamide at an application temperature of between about 175°C and about 190°C to the backbone of a book block said film having a tensile strength greater than about 400 psi and a Young's modulus of less than about 12,000 psi and b) covering said book block having said film of polyamide with a book cover having a portion thereof in substantially parallel relation to said film.

Méthode de reliure comportant les étapes suivantes : a) application d'une pellicule constituée d'au moins un polyamide thermofusible sur le dos du corps d'ouvrage à une température située entre environ 175 degrés C et 190 degrés C. Cette pellicule possède une résistance à la traction supérieure à environ 400 psi et un module d'Young inférieur à environ 12 000 psi; b) revêtement du corps d'ouvrage muni de la pellicule de polyamide avec une couverture de livre dont une partie est essentiellement parallèle à ladite pellicule.

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