Polyamide-based multi-layer structure which is used to cover...

B - Operations – Transporting – 32 – B

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B32B 27/34 (2006.01) B29C 45/16 (2006.01) C08K 5/20 (2006.01)

Patent

CA 2570988

The invention relates to a polyamide-based multi-layer structure comprising the following successive layers, namely: an upper transparent polyamide layer derived from the condensation of (i) a lactam or an alpha-omega-amino acid having at least 9 carbon atoms or (ii) a diamine and a diacid, at least one of which has at least 9 carbon atoms; a lower layer which can adhere to the substrate; and, optionally, an intermediary binding layer (known as the central layer) which is disposed between the upper layer and the lower layer, the thermomechanical behaviour (stiffness as a function of temperature) of each of said layers being sufficiently similar so that the structure can be easily shaped in response to temperature. The invention also relates to objects comprising substrates covered with said structures, whereby the lower layer is disposed against the substrate.

La présente invention concerne une structure multicouche à base de polyamide et comprenant successivement une couche supérieure en polyamide transparent provenant de la condensation: soit d'un lactame ou d'un alpha-omega-aminoacide ayant au moins 9 atomes de carbone, soit d'une diamine et d'un diacide, l'un au moins ayant au moins 9 atomes de carbone, une couche inférieure capable d'adhérer sur le substrat, éventuellement une couche intermédiaire (appelée aussi couche centrale) de liant disposée entre la couche supérieure et la couche inférieure, chacune des couches présentant un comportement thermomécanique (rigidité en fonction de la température) suffisamment proche pour permettre à la structure d'être aisément mise en forme sous l'effet de la température. L'invention concerne aussi les objets constitués de ces substrats recouverts de ces structures, la couche inférieure étant disposée contre le substrat.

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