C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4506, 400/57
C08L 77/10 (2006.01) C08L 33/02 (2006.01) C08L 67/02 (2006.01) C08L 71/12 (2006.01) C08L 77/00 (2006.01)
Patent
CA 1335008
A polyamide composition comprising an aromatic ring- containing polyamide resin and a specific amount of an aliphatic polyester. The composition has improved molding properties, such as mold release characteristics, and exhibits excellent physical properties, such as stiffness, which will not be lowered upon contact with moisture. The polyamide composition may contain additional components which have been used to improve properties other than molding properties, such as Izod impact strength and hinge effect properties, so that the effects of the components are also exerted in the present composition without sacri- ficing the main effect aimed at by the present invention, i.e., excellent molding properties. Therefore, the poly- amide composition of the present invention is useful as a molding material in various fields, e.g., automobile, elec- trical and electronic industries.
585275
Hamada Tetsuo
Ito Akira
Yakabe Sadayuki
Asahi Kasei Kogyo Kabushiki Kaisha
Goudreau Gage Dubuc
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