Polyamide composition

Details Polyamide composition Polyamide composition

C - Chemistry, Metallurgy

08

L

C08L 77/06 (2006.01) B29D 99/00 (2010.01) C08J 5/00 (2006.01) C08K 3/20 (2006.01) C08K 3/22 (2006.01)

Patent

CA 2432522

Provided is a polyamide composition comprising 100 parts by weight of (A) a polyamide having dicarboxylic acid units containing 60 to 100 mol% of terephthalic acid units, and diamine units containing 60 to 100 mol% of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 5 to 100 parts by weight of (B) a titanium oxide with an average particle size of 0.1 to 0.5 µm. The polyamide composition shows excellent heat resistance enough to withstand the SMT process, and gives a molded article with excellent whiteness and surface-reflectance.

On propose une composition de polyamide renfermant (A) 100 parties, en poids, d'un polyamide possédant des unités d'acide dicarboxylique contenant 60 à 100 % mol d'unités d'acide téréphtalique, et des unités diamine contenant 60 à 100 % mol d'unités de 1,9-nonanediamine et/ou des unités 2-méthyl-1,8-octanediamine, et (B) 5 à 100 parties en poids d'un oxyde de titaine dont la taille moyenne des particules est de 0,1 à 0,5 mu. La composition de polyamide montre une excellente résistance à la chaleur, suffisante pour supporter le procédé de montage en surface, et donne un article moulé dont la blancheur et la réflectance superficielle sont très satisfaisantes.

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