Polyamide compositions

Details Polyamide compositions Polyamide compositions

C - Chemistry, Metallurgy

08

L

18/1213, 400/581

C08L 77/00 (2006.01) C08L 23/08 (2006.01)

Patent

CA 1063286

POLYAMIDE COMPOSITIONS ABSTRACT OF THE DISCLOSURE A polyamide composition comprising 50 to 95 parts by weight of a polyamide and 50 to 5 parts by weight of an ethylenic copolymer of ethylene, an alkyl ester of unsaturated carboxylic acid, an un- saturated carboxylic acid and a metal salt of unsaturated carboxylic acid has excellent processability such as fluidity at melting and remarkably improved impact strength when molded. The polyamide composition may further contain one or more inorganic materials such as glass fiber without lowering physical properties.

249494

Affiliated with

Also associated with

Rating

Polyamide compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyamide compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyamide compositions will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-769317