Polyamide compositions comprising a thermoplastically...

C - Chemistry – Metallurgy – 08 – G

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C08G 69/36 (2006.01) C08G 69/32 (2006.01) C08K 5/20 (2006.01) C08L 77/10 (2006.01)

Patent

CA 1325307

ABSTRACT OF THE DISCLOSURE Molding compounds comprising aromatic polyamides which contain from 0.01 to 10 mole % of a low molecular weight carboxylic acid amide display low melt viscosities and an increased resistance to hydrolysis and are thermoplastically processible.

590715

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