B - Operations – Transporting – 01 – D
Patent
B - Operations, Transporting
01
D
B01D 15/00 (2006.01) B01J 45/00 (2006.01)
Patent
CA 2384631
Compositions and methods for selectively binding metal ions from source solutions are disclosed. The compositions include 1) polyamide-containing ligands covalently bonded to a particulate solid support, and 2) polyamide- containing polymeric resins. In the case of the ligand bonded to the solid support, the ligand is bounded or tethered to the solid support through a hydrophilic spacer such that the overall formula is SS-A-X-L. In this formula, SS is a particulate solid support such as silica or a polymeric bead, A is a covalent linkage mechanism, X is a hydrophilic spacer grouping, and L is a polyamide-containing ligand having three or more amide groups and two or more amine nitrogens separated by at least two carbons with the proviso that when SS is a particulate organic polymer, A-X may be combined as a single covalent linkage. With respect to the polyamide ligand-containing polymeric resin, this composition is a reaction product of a hydroxymethylated polyamide ligand and a polymerization and/or crosslinking agent.
L'invention concerne des compositions et des procédés pour la liaison sélective d'ions métalliques de solutions sources. Les compositions comprennent 1) des ligands à base de polyamide en liaison covalente avec un support particulaire solide 2) des résines à base de polyamide. Les ligands sont liés ou fixés au support solide par un espaceur hydrophile selon la formule générale SS-A-X-L. Dans cette formule, SS est un support solide particulaire du type perle de silice ou de polymère, A est un mécanisme de liaison covalente, X est un groupe espaceur hydrophile, et L est un ligand à base de polyamide ayant trois ou plus de trois groupes amide et deux ou plus de deux atomes d'azote à fonction amine séparés par au moins deux atomes de carbone, à condition que lorsque SS est un polymère organique particulaire, A-X puisse être combiné comme une liaison covalente unique. La résine polymère à base de polyamide qui contient des ligands est un produit de la réaction entre un ligand à base de polyamide hydroxyméthylé et un agent de polymérisation et/ou de réticulation.
Bruening Ronald L.
Krakowiak Krzysztof E.
Ibc Advanced Technologies Inc.
Smart & Biggar
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