Polyamide molding compositions and electrical and electronic...

Details Polyamide molding compositions and electrical and electronic... Polyamide molding compositions and electrical and electronic...

C - Chemistry, Metallurgy

08

L

C08L 77/06 (2006.01) C08K 3/00 (2006.01) C08L 25/18 (2006.01) C08L 77/00 (2006.01)

Patent

CA 2495095

Polyamide molding compositions with improved blistering properties and electrical or electronic components made therefrom are provided. These compositions and components comprise 20-80 weight percent of polyamide or polyamide blend and comprising units derived from terephthalic acid or a derivative, and an aliphatic diamine with 10-20 carbons. Select ranges of inorganic filler and flame retardant and synergist are also disclosed.

L'invention concerne des mélanges à mouler à base de polyamide présentant une résistance améliorée au cloquage, et des composants électriques ou électroniques formés avec ces mélanges. Ces compositions et composants contiennent de 20 à 80 pour-cent en poids de polyamide ou d'un mélange de polyamide comprenant des motifs dérivés d'acide téréphtalique ou d'un dérivé de celui-ci, et une diamine aliphatique comprenant 10-20 carbones. L'invention concerne également des groupes choisis de charges inorganiques, de charges ignifugeantes et d'additifs synergiques.

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