Polyamide release film for use in the production of molded...

C - Chemistry – Metallurgy – 08 – L

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C08L 77/06 (2006.01) B32B 7/06 (2006.01)

Patent

CA 2201386

A mold or release carrier film for use in the manufacture of molding compound composites formed from a blend of a film forming polyamide resin and at least one release agent material selected from the group consisting of (1) secondary amides of the formula: R1-CO-NH-R2 and (2) N,N' ethylene bis amides of the formula: R1-CO-NH-CH2-CH2-NH-CO-R2 wherein R1 is an aliphatic hydrocarbon chain of about 14 to about 42 carbon atoms, and R2 is a hydrogen atom or an aliphatic hydrocarbon chain of about 14 to about 42 carbon atoms; or (3) calcium stearate; (4) a mixture of calcium stearate and silicone; (5) a mixture of calcium stearate and polytetraflurorethylene; (6) polypropylene; (7) modified polypropylene; (8) waxes; (9) fluoroelastomers; and (10) silicones; with the proviso that any modified polypropylene present does not exceed 3% by weight.

Support pelliculaire de démoulage pour utilisation dans la fabrication de composés composites de moulage formé à partir d'un mélange d'une résine de polyamide filmogène et d'au moins un agent de démoulant choisi parmi le groupe constitué (1) d'amides secondaires de formule : R1-CO-NH-R2 et (2) de N,N'-étylène-bis-amides de formule : R1-CO-NH-CH2-CH2-NH-CO-R2 où R1 est une chaîne hydrocarbonée aliphatique d'environ 14 jusqu'à environ 42 atomes de carbone, et R2 est un atome d'hydrogène ou une chaîne hydrocarbonée aliphatique d'environ 14 jusqu'à environ 42 atomes de carbone; ou (3) de stéarate de calcium; (4) d'un mélange de stéarate de calcium et de silicone; (5) d'un mélange de stéarate de calcium et de polytétrafluoréthylène; (6) de polypropylène; (7) de polypropylène modifié; (8) de cires; (9) de fluoroélastomères; et (10) de silicones; à la condition que tout le polypropylène modifié présent n'excède pas 3 % en poids.

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