Polyamide resin composition

Details Polyamide resin composition Polyamide resin composition

C - Chemistry, Metallurgy

08

L

C08L 77/06 (2006.01) C08L 77/00 (2006.01) C08L 77/02 (2006.01) C08L 25/18 (2006.01)

Patent

CA 2357105

A polyamide resin composition is provided, which contains 100 parts by weight of a polyamide resin (A) that has dicarboxylic acid units (a) containing from 60 to 100 mol% of terephthalic acid units and diamine units (b) containing from 60 to 100 mol% of C6-18 aliphatic alkylenediamine units, and from 1 to 100 parts by weight of a polybromostyrene (B), in which from 0.5 to 100 % by weight of the polybromostyrene (B) is a polybromostyrene having an epoxy group. The polyamide resin composition has good flame retardancy, good chemical resistance, good surface appearance and good blistering resistance.

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