Polyamide resin composition

C - Chemistry – Metallurgy – 08 – L

Patent

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400/5802

C08L 77/00 (2006.01) C08K 5/092 (2006.01)

Patent

CA 2014243

(24) AE 6443 A B S T R A C T The invention relates to a polyamide resin composition, comprising a mixture of 30 to 90 parts by weight of (a) a polyamide with a C/N ratio of between 4 and 7, (b) 10 to 70 parts by weight of a polyamide with C/N ratio of more than 7 and (c) 0.02 to 3 parts by weight based on 100 parts by weight of the mixture of a compound containing two or more carboxyl groups or an acid anhydride group. The composition shows excellent moldability and resistance to metallic halide compounds.

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