C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4601
C08L 77/00 (2006.01) B60R 13/04 (2006.01) F02F 7/00 (2006.01)
Patent
CA 1306560
Abstract of the Disclosure A polyamide resin composition comprising: (a) 5 to 65% by weight of at least one polyamide resin selected from the group consisting of a polyamide having caproamide units, a polyamide having hexamethylene adipamide units and a polyamide having aromatic rings as a main molecular unit in the polymer, (b) 65 to 30% by weight of a polyamide resin which is obtained by melt polymerization of at least one compound selected from the group consisting of an aliphatic aminoacid and lactum having 11 or 12 carbon atoms and an equivalent molar salt having 13 to 24 carbon atoms of an aliphatic diamine having 6 to 12 carbon atoms and an aliphatic dicarboxylic acid having 6 to 12 carbon atoms, and (c) 30 to 5% by weight of a polyphenylene oxide. This polyamide resin composition is excellent in properties of a thermal resistance, a heating-cooling repeat resistance, a rigidity, a toughness and a road antifreezing agent resistance, and a shaped article of it is useful for an exterior part of automobile.
593458
Nomura Toshimi
Terashima Takeshi
Ridout & Maybee Llp
Toray Industries Inc.
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