Polyamide resin composition and connector

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 77/06 (2006.01) C08K 5/13 (2006.01) C08K 5/372 (2006.01) C08L 33/02 (2006.01) C08L 51/06 (2006.01) C08L 51/08 (2006.01) C08L 77/10 (2006.01) H01B 3/30 (2006.01)

Patent

CA 2091963

The resin composition of the invention comprises as resin components specific aromatic polyamide (A) in an amount of 50 to 85 o by weight, a specific graft-modified polymer (B) in an amount of 10 to 40 % by weight and aliphatic polyamide (C) in an amount of 1 to 15 % by weight, and further comprises plural antioxidants comprising a hindered phenol type antioxidant (D) having a molecular weight of not less than 500 and a TGA 10 % weight loss temperature of not lower than 300 °C and a sulfur type antioxidant (E) having a molecular weight of not less than 600 and a TGA 10 o weight loss temperature of not lower than 280 °C. In this resin composition, the total amount of (D) and (E) is in the range of 0.2 to 4 parts by weight per 100 parts by weight of the resin components, and a weight ratio between (D) and (E) is in-the range of 1 : 5 to 5 . 1. The connector of the invention has housing formed from the above-mentioned resin composition. The resin composition of the invention shows excellent heat resistance. The connector of the invention is lightweight and is excellent in heat resistance, water resistance and chemical resistance.

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