C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 77/06 (2006.01) C08K 3/16 (2006.01) C08K 3/36 (2006.01) C08K 7/06 (2006.01) C08K 7/14 (2006.01) C08K 13/04 (2006.01) C08L 77/00 (2006.01)
Patent
CA 2099066
The present invention provides a polyamide resin composition which comprises: (A), as a polyamide component, 30-95% by weight of a polyamide resin which is a half-aromatic polyamide comprising (a) 70-95% by weight of hexamethyleneadipamide unit obtained from adipic acid and hexamethylenediamine and (b) 5-30% by weight of hexamethyleneisophthalmide unit obtained from isophthalic acid and hexamethylenediamine and which has a sulfuric acid solution viscosity ~r of 1.5-2.8 and (B) 5-70% by weight of at least one inorganic filler selected from glass fiber, carbon fiber, mica, talc, kaolin, wollastonite, calcium carbonate and potassium titanate. Molded articles having a high surface gloss arid comprising said resin composition are also provided.
Ebara Kenji
Nishino Hiroshi
Asahi Kasei Kogyo Kabushiki Kaisha
Goudreau Gage Dubuc
LandOfFree
Polyamide resin composition and molded articles obtained... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polyamide resin composition and molded articles obtained..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyamide resin composition and molded articles obtained... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1495955