Polyamide resin composition excellent in plate adhesion

Details Polyamide resin composition excellent in plate adhesion Polyamide resin composition excellent in plate adhesion

C - Chemistry, Metallurgy

08

L

400/7801, 400/78

C08L 77/00 (2006.01) C08K 3/34 (2006.01) C08K 7/04 (2006.01)

Patent

CA 1247777

ABSTRACT OF THE DISCLOSURE A polyamide resin composition excellent in plate adhesion which consists essentially of 35% to 90% by weight of a polyamide resin, 5% to 60% by weight of an inorganic fiber, e. g. carbon fiber, and 5% to 50% by weight of wollastonite.

457528

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