Polyamide resin compositions

Details Polyamide resin compositions Polyamide resin compositions

C - Chemistry, Metallurgy

08

L

400/5339

C08L 77/00 (2006.01) C08L 83/04 (2006.01)

Patent

CA 1278394

Abstract of the Disclosure The present invention relates to polyamide resin compositions con- taining 100 parts by weight of a polyamide with tetramethylene adipamide as main component and 2 to 20 parts by weight of silicon oil. The compositions display superior sliding characteristics.

495747

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