Polyamide resin compositions

C - Chemistry – Metallurgy – 08 – L

Patent

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400/4506, 400/58

C08L 67/03 (2006.01) C08L 77/00 (2006.01) C08L 77/10 (2006.01)

Patent

CA 2002368

ABSTRACT There is disclosed a polyamide resin composition which comprises: (A) an aromatic polyamide resin comprising (a) a dicarboxylic acid component which comprises an aromatic dicarboxylic acid component and (b) a diamine component comprising at least one of an aliphatic diamine component and an alicyclic diamine component; (B) an olefin copolymer in amounts of 0.5-50 parts by weight in relation to 100 parts by weight of the aromatic polyamide resin, the olefin copolymer comprising an .alpha.-olefin component and an .alpha., .beta.- unsaturated carboxylic acid glycidyl ester component in amounts of 1-30 % by weight based on the copolymer. The polyamide resin composition may further contain a polyarylate in amounts of 10-200 parts by weight in relation to 100 parts by weight of the polyamide resins wherein the polyarylate is polymerization products of bisphenols and aromatic dicarboxylic acids or their derivatives.

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