Polyamide resins

Details Polyamide resins Polyamide resins

C - Chemistry, Metallurgy

08

G

402/234

C08G 69/34 (2006.01) C09J 3/16 (1985.01)

Patent

CA 1271292

ABSTRACT OF THE DISCLOSURE Thermoplastic polyamide resins showing improved substrate adhesion and consisting essentially of poly- condensates of the following components: a) from 25 to 50 mole percent dimer fatty acids, b) from 25 to 45 mole percent of one or more aliphatic, aromatic and/or cyclic C2-C40 diamines which are diprimary diamines, diamines containing secondary amino groups and alkyl substituents with no more than 8 carbon atoms on the N-atom, or heterocyclic diamines capable of diamide formation, c) from 5 to 25 mole percent of aliphatic diamines capable of diamide formation and N-alkyl substituted on at least one N-atom, containing from 2 to 10 C- atoms and from 10 to 25 carbon atoms in the N-alkyl group, and d) from 0 to 25 mole percent aliphatic C6-C22 dicar- boxylic acids.

517707

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