Polyamides

C - Chemistry – Metallurgy – 08 – G

Patent

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402/236, 154/107

C08G 69/34 (2006.01) C09J 5/06 (2006.01) C09J 3/16 (1980.01)

Patent

CA 1120193

ABSTRACT OF THE DISCLOSURE Novel polyamides are provided herein which are suitable as hot- melt adhesives. The polyamids contain groups derived from a polymeric fatty acid containing 70 - 99% by weight of dinner acid and from 90 - 110 mole percent of an amine component cioonsisting essentially of 10 - 100 mole percent trialone of the structure Image in which R1 is a C1-C3 alkyl groups and R2 and R3 are the same or differ- ent bivalent hydrocarbon radicals together containing from 4 - 24 carbon atoms. The polyamide has an acid value less than 15 and an amine value between 10 and 125. Optionally, the polyamide also contains 0 - 90 mole percent of a C2-C20 diamine, or a dicarboxylic acid containing 6 - 12 car- bon atoms, or a monocarboxylic acid or a C5-C12 lactam. These polyamides combine toughness and elongation on the one hand and high peeling strength on the other hand, and moreover are based on normal technical grades of polymeric fatty acids.

298408

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