C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 7/04 (2006.01) C08G 69/40 (2006.01) C09J 5/02 (2006.01) C09J 177/06 (2006.01)
Patent
CA 2199813
The present invention is a novel remoistenable adhesive and an improvement in the bonding method for an envelope, a stamp, a sticker, a packaging tape or a label using a remoistenable adhesive, wherein the remoistenable adhesive is a hot melt consisting of a thermoplastic polyamide prepared from an acid component selected from the group consisting of adipic acid, pimelic acid, azelaic acid, suberic acid and sebacic acid, and an alkyleneoxy diamine component consisting of one or more diamine compounds having the formula: H2N- CyH2y-(OC2H4)x-O-CyH2y-NH2 where y is 2 or 3 and x is 1-50.
Nouvel adhésif réhumectable et amélioration du procédé de collage d'une enveloppe, d'un timbre, d'un autocollant, d'une bande d'emballage ou d'une étiquette grâce à un adhésif réhumectable. Ledit adhésif réhumectable est un adhésif thermofusible constitué de polyamide thermoplastique préparé à partir d'un constituant acide sélectionné dans le groupe comprenant acide adipique, acide pimélique, acide azélaïque, acide subérique et acide sébacique et d'un constituant alkylèneoxy diamine comprenant un ou plusieurs composés diamine de formule H¿2?N-C¿y?H¿2y?-(OC¿2?H¿4?)¿x?-O-C¿y?H¿2y?-NH¿2?, dans laquelle y vaut 2 ou 3 et x vaut de 1 à 50.
H.b. Fuller Licensing & Financing Inc.
Rogers Law Office
LandOfFree
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