C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 67/06 (2006.01) C08F 283/01 (2006.01) C08J 3/28 (2006.01) C09D 4/06 (2006.01) C09D 167/06 (2006.01)
Patent
CA 2193529
A liquid, radiation curable composition is disclosed that includes a reactive diluent to lower initial application viscosity without substantial reduction of cure rate. The composition of the present invention comprises: (a) an unsaturated polyester polymer; (b) a non-polymerized, cocurable polyfunctional vinyl ether component; and (c) a reactive diluent which is an unsaturated dioic acid ester having the structural formula (1), wherein at least one of R1 and R2 is a group that includes an oxygen with a carbon adjacent thereto and an abstractable hydrogen attached to the carbon.
La présente invention concerne une composition liquide durcissable par l'effet de radiation. Cette composition incorpore un diluant réactif permettant d'abaisser la viscosité d'application initiale sans abaissement sensible du taux de durcissage. La formule selon la présente invention comporte: (a) un polymère de polyester insaturé; (b) un composant éther vinylique polyfonctionnel co-durcissable non polymérisé; et (c) un diluant réactif portant un ester d'acide dioïque insaturé représenté par la formule générale (1). Dans ladite formule générale (1), l'un au moins parmi R?1¿ ou R?2¿ est un groupe contenant un oxygène portant un carbone adjacent, un hydrogène extractible étant lié au carbone.
Friedlander Charles B.
Mcentire Edward E.
Weissberg Alan B.
Borden Ladner Gervais Llp
Ppg Industries Ohio Inc.
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