C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
220/3, 400/4919
C08L 23/04 (2006.01) B65D 30/02 (2006.01) C08J 5/18 (2006.01) C08L 23/06 (2006.01) C08L 23/08 (2006.01)
Patent
CA 1340356
A polyethylene resin composition comprised of (A) 30 to 50% by weight of a linear low density polyethylene resin wherein (i) the MFR190°C is 0.3 to 3.0/10 min, (ii) the density is 0.900 to 0.918 g/cc, (iii) the MI20/MI2 is 40 or less, (iv) there are one or more endothermic peaks of the melting point determined by a differential scanning calorimeter, wherein, when there are two or more peaks, the highest melting point (T m1) is 118 to 125°C and the ratio T m1H/T m2H between the endothermic peak height (T m1H) of the highest melting point and the next low temperature side endothermic peak height (T m2H) of 1.2 or less, and (v) the comonomer is an .alpha.-olefin having four or more carbon atoms; (B) 20 to 40% by weight of a high density polyethylene resin wherein (i) the MFR190°C is 0.01 to 0.2 g/10 min, (ii) the density is 0.935 to 0.950 g/cc, and (iii) the MI20/MI2 is 80 or more, (C) 10 to 40% by weight of a high pressure low density polyethylene resin wherein (i) the MFR190°C is 0.1 to 2.0 g/10 min, (ii) the density is 0.915 to 0.924 g/cc, and (iii) the melt tension is 5 g or more, wherein the polyethylene resin composition is characterized in that (i) the MFR190°C is 0.2 to 1.0 g/10 min, (ii) the density is 0.918 to 0.935 g/cc, and (iii) the melt tension is 5 g or more. The polyethylene resin has excellent balance of strength, rigidity and gloss and is excellent in moldability. When made in a film form, the resin has excellent sealability and low temperature resistance. The film is particularly suitable for producing heavy duty packaging bags.
610037
Matsunaga Takasi
Nisimura Tosihiro
Mitsui Petrochemical Industries Ltd.
Smart & Biggar
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