Polyfunctional cyanate resin composition and...

Details Polyfunctional cyanate resin composition and... Polyfunctional cyanate resin composition and...

C - Chemistry, Metallurgy

08

L

C08L 79/00 (2006.01) C08G 59/40 (2006.01) C08G 73/06 (2006.01) C08L 63/00 (2006.01) C08L 79/04 (2006.01) H01L 23/29 (2006.01)

Patent

CA 2253099

Provided is a polyfunctional cyanate resin composition comprising (A) a polyfundtional cyanate resin having a functional number of 2 or more or its prepolymer, (B) an epoxy resin having a softening point or melting point of 75°C or more, and (C) a curing catalyst as indispensable components, and a resin-encapsulated type semiconductor device using the same, which has a high heat resistant property, a low coefficient of thermal expansion, and an excellent blocking resistance of a resin compound.

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