C - Chemistry – Metallurgy – 07 – C
Patent
C - Chemistry, Metallurgy
07
C
C07C 39/15 (2006.01) C07C 39/24 (2006.01) C07D 303/24 (2006.01) C08G 8/04 (2006.01) C08G 59/06 (2006.01) C08G 59/08 (2006.01) C08G 59/32 (2006.01) C08L 63/00 (2006.01) C08L 63/04 (2006.01) H01L 23/29 (2006.01)
Patent
CA 2079821
ABSTRACT The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The polyhydric phenols are represented by the following formula. Image wherein R1 independently represents a halogen atom, an alkyl or cycloalkyl group of 1-9 carbon atoms, an alkoxy group of 4 or less carbon atoms or an aryl group and may be identical or different when ? is 2 or more, R2 independently represents a halogen atom, an alkoxy group of 4 or less carbon atoms or an alkyl group of 6 or less carbon atoms and R2 may be identical or different when m is 2 or more, R3 independently represents a hydrogen atom or an alkyl group of 6 or less carbon atoms, the average recurring unit number n is 0-10, ? is 0-4 and m is 0-7, and can be contained as a curing agent in an epoxy resin composition which is used not only for giving cured products but also for encapsulating semiconductor devices .
Kamio Kunimasa
Kanagawa Shuichi
Morimoto Takashi
Naitoh Shigeki
Saito Noriaki
Fetherstonhaugh & Co.
Sumitomo Chemical Co. Ltd.
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