Polyimide adhesion on reactive metals

Details Polyimide adhesion on reactive metals Polyimide adhesion on reactive metals

B - Operations, Transporting

32

B

B32B 15/08 (2006.01) B32B 27/06 (2006.01) H01L 21/312 (2006.01) H01L 21/469 (2006.01) H01L 23/29 (2006.01) H05K 3/38 (2006.01) H05K 1/03 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2051174

In order to improve the adhesion of a polyimide layer to an underlying metal surface, an organic solution which cures to a silsesquioxane copolymer is applied to the surface. The polyimide and the copolymer are formed during a simultaneous curing step.

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