Polyimide coating process and material

C - Chemistry – Metallurgy – 09 – K

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117/196, 400/411

C09K 3/00 (2006.01) C08L 79/08 (2006.01) H01L 21/312 (2006.01) H01L 21/56 (2006.01) H01L 23/29 (2006.01) H01L 23/31 (2006.01) H05K 3/28 (2006.01)

Patent

CA 1108330

Abstract A protective layer composition, suitable for protecting metal electrodes on components and other microelec- tronic circuitry, comprises an organic thermoplastic polymeric material, an organic solvent or solvents, and a non-ionic fluorocarbon surfactant as a wetting/level- ing/flow control agent. A typical formulation com- prises an aromatic polymer which cures to form a poly- amide-imide polymer, an organic solvent or a mixture of organic solvents and a non-ionic fluorocarbon surfactant.

328103

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