C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
117/196, 400/720
C08G 77/455 (2006.01) B32B 27/34 (2006.01) C08G 73/10 (2006.01) C08L 79/08 (2006.01) C08L 83/00 (2006.01) C09D 179/08 (2006.01)
Patent
CA 2037103
A low modulus, solvent resistant, wet etchable polyimide useful in electronic applications as passivation and insulating coatings, said polyimides containing a 4,4'-bis(p- aminophenoxy)biphenyl moiety, a siloxane diamine moiety, and a dianhydride moiety.
Burgess Marvin Jay
Palka Agnes Marie
Wargowski David Allen
Gowling Lafleur Henderson Llp
The Texas A&m University System
LandOfFree
Polyimide copolymers containing 4,4'-bis(p-aminophenoxy)... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polyimide copolymers containing 4,4'-bis(p-aminophenoxy)..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyimide copolymers containing 4,4'-bis(p-aminophenoxy)... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1564301