C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
402/216, 204/96.
C08J 5/18 (2006.01) B29C 59/10 (2006.01) B29C 59/14 (2006.01) B29D 7/01 (2006.01) C08L 79/08 (2006.01) B29C 71/02 (2006.01) H05K 1/03 (2006.01) H05K 3/38 (2006.01)
Patent
CA 1322624
ABSTRACT OF THE DISCLOSURE The present invention provides a polyimide film of which the residual content of volatiles is reduced to not more than 0.45 weight 1 on the basis of the film, and further a polyimide film of which the residual content of volatiles is reduced to not more than 0.45 weight % on the basis of the film and of which the oxygen/carbon ratio in the surface lager is increased by 0.01-0.1, and manufacturing methods therefor. According to the present invention, it is possible to provide a polyimide film of improved adhesion in a stable and homogeneous manner, and this improvement in adhesion is achieved in the film-forming process, not in a separate process of after-treatment.
545287
Kidoh Masaro
Kitai Katuhiro
Nojiri Hitoshi
Ohnari Yoshihide
Yamamoto Tsuneo
Borden Ladner Gervais Llp
Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
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