C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
18/1032, 400/770
C08L 79/08 (2006.01) C08J 5/18 (2006.01) C08K 5/00 (2006.01)
Patent
CA 1287938
ABSTRACT OF THE DISCLOSURE Disclosed herein are a new polyimide film which comprises containing therein 30 to 800 ppm of titanium based on the weight of the film, and a process for producing a new polyimide film which comprises introducing a specific titanium-containing substance into the film- forming polyimide resin prior to the casting step. The invention is intended to control the film surface forming process and improve directly the adhesive properties of the film.
524101
Kawai Hideki
Nagano Hirosaku
Nojiri Hitoshi
Takase Junji
Yamamoto Tsuneo
Borden Ladner Gervais Llp
Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
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