Polyimide film having improved adhesive properties

Details Polyimide film having improved adhesive properties Polyimide film having improved adhesive properties

C - Chemistry, Metallurgy

08

L

204/96.24

C08L 79/08 (2006.01) B29C 71/04 (2006.01) C08K 3/00 (2006.01) C08K 3/22 (2006.01) C08K 3/32 (2006.01) C08K 3/34 (2006.01) G02B 5/04 (2006.01) G02B 6/00 (2006.01) G02B 27/00 (2006.01) G03B 27/54 (2006.01) H04N 1/04 (2006.01)

Patent

CA 1314517

ABSTRACT OF THE DISCLOSURE Disclosed herein is a polyimide film produced by forming a film from a raw material having incorporated therein a finely divided inorganic powder that forms minute projections on the film surface and subsequently subjecting the film to corona discharge treatment. According to this invention, it is possible to obtain a heat-resistant polyimide film having improved adhesive properties and uniform bond strength. The film does not cause blocking when wound into a roll. Polyimide film finds general use as electrical insulation film, heat insulation film and base film for flexible printed circuit boards.

527950

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