Polyimide modified epoxy resins in aqueous emulsions for...

C - Chemistry – Metallurgy – 08 – G

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400/5908, 400/59

C08G 59/44 (2006.01) C07D 209/48 (2006.01) C08G 59/62 (2006.01) C08J 3/03 (2006.01) C08J 5/24 (2006.01) C08L 63/10 (2006.01) C09D 5/44 (2006.01)

Patent

CA 1283746

ABSTRACT OF THE DISCLOSURE Disclosed is an emulsion having a discontinuous phase that consists of a water dispersed or water emulsified epoxy resin in water having at least two epoxide groups, a water soluble salt of an imide compound having at least one carboxyl group, and a crosslinking agent; the discontinuous phase has excess epoxide functionality. The continuous phase is water. A method of forming a coating on a conductive substrate is also disclosed. The substrate and an electrode are immersed into the emulsion and a direct current is applied between the substrate and the electrode to electrophoretically deposit a coating on the substrate of the epoxy resin, the imide compound, and the crosslinking agent. The substrate is removed from the emulsion and is heated to a temperature sufficient to cure the coating. The compounds may have the general formula Image and amine salts thereof.

519994

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