Polyimide/polyarylate resin compositions and moldings thereof

C - Chemistry – Metallurgy – 08 – L

Patent

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C08L 67/00 (2006.01) C08J 5/00 (2006.01) C08L 67/03 (2006.01) C08L 69/00 (2006.01) C08L 79/08 (2006.01) C09D 179/08 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2353647

Resin compositions comprising polyimides composed of repeating units represented by general formula (1), (wherein Ar0 is a C6-C15 aromatic hydrocarbon group; and R1 is at least one member selected from the group consisting of divalent residues obtained by removing two amino groups from a C2-C30 aliphatic diamine and those obtained by removing two amino groups from a C4-C30 alicyclic diamine), and polyarylates or polyester carbonates. The compositions are excellent in heat resistance, dimensional stability and transparency, among which ones exhibiting particularly excellent transparency are suitable for bases of flexible printed boards or other moldings.

Cette invention concerne des compositions de résines comprenant des polyimides qui se composent d'unités répétitives correspondant à la formule générale (1) où Ar?0¿ représente un groupe hydrocarbure aromatique C¿6?-C¿15?, tandis que R?1¿ représente au moins un élément choisi dans le groupe comprenant des résidus divalents obtenus en éliminant deux groupes amino d'un diamine aliphatique C¿2?-C¿30? ainsi que ceux obtenus en éliminant deux groupes amino d'un diamine alicyclique C¿4?-C¿30?. Ces compositions de résines comprennent également des polyarylates ou carbonates de polyester. Ces compositions possèdent d'excellentes qualités de résistance thermique, de stabilité dimensionnelle et de transparence, et celles qui possèdent une transparence particulièrement excellente peuvent être utilisées comme bases pour des plaques imprimées flexibles ou autres articles moulés.

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