Polyimide ribbon and method for thermal printing

B - Operations – Transporting – 41 – J

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B41J 31/00 (2006.01) B41J 31/05 (2006.01)

Patent

CA 1176055

POLYIMIDE RIBBON AND METHOD FOR THERMAL PRINTING Abstract This invention comprises a resistive layer of a thermal transfer medium which is a mixture of a thermosetting polyimide and a thermoplastic polyimide with a particulate conductive material, which may be graphite. The resistive layer of blended polyimides is advantageously laminated to a very thin layer of silicon dioxide which provides heating properties near the printing area. The thermosetting polyimide is commercially available as a liquid in a high-boiling organic solvent system. The thermoplastic polyimide is commercially available as a solid, and is known to be readily soluble in tetrahydrofuran (THF) and many other organic solvents. A blend of the two with appropriate solvents and filler of particular conductive material such as graphite is solid to the touch within 60 seconds at room temperature. After subsequent treatment at elevated temperature to set the thermosetting resin, a thermal ribbon is achieved having the necessary physical integrity and exceptionally good resistance to degradation during use in the thermal printing process. The element is strong and abrasion resistant, and has electrical resistivity well suited to the thermal printing. LE9-81-010

414910

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